ANSYS
®
  model.  Yet,  it  is  important  to  realize  that  BUSNET  is 
creating  and  solving  a  lot  more  than  the  busbar  network,  it  is 
creating  and  solving  the  full  cell  network  as  well  (see  figure  8). 
BUSNET  results  are  as follow: the maximum temperature reached 
in the positive busbar is 94ºC and in the negative busbar is 197 ºC; 
the global busbar network drop is 224 mV with 247.0 kA or 49.4% 
passing in the negative or downstream side and 253.0 kA or 50.6% 
passing in the positive or upstream side. 
 
Figure  8.  Thermal  solution  of  the  BUSNET  full  cell  and  busbar 
model. 
The fact that the network current balance between the positive and 
negative  sides  is  closer  to  50%  50%  than  both  the  3D  and  1D 
ANSYS
®
  models  can  easily  be  explained  by  the  fact  that  by 
modeling also the cathode blocks, BUSNET is solving the problem 
more  accurately  because  the  true  equipotential  condition  is  at  the 
metal pad above the cathode block. If the current distribution is not 
uniform  between  the  positive  and  negative  sides  of  the  cell,  the 
potential in the cathode flexibles will not be the same between the 
positive and negative sides and this of course have an impact on the 
current distribution itself. 
This  little  comparison  exercise  just  highlighted  the  fact  that  to 
accurately  compute  the  busbar  network  current  distribution,  it  is 
important to consider also the cathode block resistance layer as the 
two  valid  equipotential  points  are  the  metal  pad  and  the  anode 
beam not the cathode flexibles and the anode beam. 
So  from  that  fact  alone,  BUSNET  the  1D  versatile  busbar  model 
part  of  MHD-Valdis  is  a  better  tool  to  carry  out  a  busbar  sizing 
optimization  study.  But  this  is  not  the  only  reason,  BUSNET user 
input file is also quite easy to edit and TECPLOT is a powerful and 
easy  to  learn  postprocessor,  making  BUSNET  a  user  friendly  tool 
to use. 
Conclusions 
It  was  demonstrated  that  it  is  not  possible  to  reduce  a  given  3D 
busbar geometry into a 1D line elements network geometry without 
loosing some accuracy. 
It  was  demonstrated  that  the  global  heat  transfer  coefficient 
between the busbar external surfaces and its surrounding has a big 
impact  on  the  busbar  thermal  balance.  An  improper  setup  of  that 
temperature  dependent  parameter  will  affect  significantly  the 
accuracy of the model. 
It was demonstrated that it is not possible to accurately compute the 
busbar  network  current  balance  without  including  the  cathode 
blocks  because  the  potential  at  the  end  of  the  cathode  flexibles  is 
itself influenced by the current balance. 
Finally,  MHD-Valdis  is  the  modeling  tool  recommended  to  carry 
out  a  busbar  sizing  optimization  study  because  it  is  very  efficient, 
versatile and user friendly. The maximum accuracy will be obtained 
by using an ANSYS
®
 based 3D full cell and external busbar model, 
but  that  tool  is  not  at  all  practical  to  carry  out  an  optimization 
study. 
References 
1.  T.  Tvedt  and  H. G. Nebell, "NEWBUS, a Simulation Program 
for  Calculation  of  the  Current  Distribution  in  the  Bus  Bar 
System  of  Alumina  Reduction  Cells",  Light  Metals,  TMS, 
(1988), 567-573. 
2.  J. I. Buiza, "Electromagnetic Optimization of the V-350 Cell", 
Light Metals, TMS
, (1989), 211-214. 
External  Busbars  Thermo-Electric  Model",  Proceedings  of  the 
41
st 
Conference on Light Metal, CIM
, (2002), 25-39. 
Thermo-Electric  and  MHD  Mathematical  Models  of  a  500  kA 
Al  Electrolysis  cell:  Part  2",  Light  Metals,  TMS,  (2004),  453-
459. 
Electric  and  MHD  Mathematical  Models  of  an  Aluminium 
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7.  V.    Bojarevics  and  M.V.  Romerio,  "Long  Wave  Instability  of 
Liquid  Metal-electrolyte  Interface  in  Aluminium  Electrolysis 
Cells:  a  Generalization  of  Sele's  Criterion",  Eur.  J.  Mech., 
B/Fluids
, 13 (1) (1994), 33-56. 
8.  V.  Bojarevics,  "Non-Linear  Waves  with  Electromagnetic 
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and Y. Unger, AIAA, (1998), Chapter 58, 833-848. 
Thermo-Electric  and  MHD  Mathematical  Models  of  a  500  kA 
Al  Electrolysis  cell",  Proceedings  of  the  42
nd 
Conference  on 
Light Metals, CIM
, (2003), 3-20. 
10. V.  Bojarevics,  "MHD-Valdis  Reference  Manual",  Greenwich 
University
,  (2005). 
11. M.  Dupuis,  "Computation  of  Heat  Transfer  Coefficient  Tables 
Establishing  Boundary  Conditions  between  Hot  Surfaces  and 
their Surroundings", GeniSim Internal report,  (1996). 
Saravanan,  "Accurate  Assessment  of  the  Hirakud  Smelter 
Aluminium  Reduction  Cell  Thermal  Balance  using  only 
Temperature  Measurements",  Proceedings  of  the  43
nd 
Conference on Light Metals, CIM
, (2004), 525-533. 
13. "TECPLOT  User's  Manual",  Amtec  Engineering,  (2005), 
www.tecplot.com/support/tecplot_documentation.htm